Contract Manufacturing Solution

  • State of Art Contract manufacturing facility
  • SMT and through hole mount PCB Assembly
  • BGA, FBGA and fine pitch components assembly
  • X-Ray Inspection and AOI
  • Board & System level Testing, Conformal Coating and Box build solution
  • Cable & Wire harness Assembly & Electromechanical assembly
  • ESD Safe, Dust free environment with team of experienced and trained professionals
  • Stencil Component Supply chain solution and custom labeling and packaging
  • Total turnkey solution

PCB Assembly

Our capability includes

  • Surface Mount (SMT) PCB Assembly
  • Through Hole PCB Assembly
  • Mixed or Complex SMT and Through Hole PCB Assembly
  • PBGA (Pitch Ball Grid Array), FBGA (Fine Ball Grid Array), Micro-BGA, CSP, Ultra-fine pitch QFP and QFN
  • Fine Pitch (0201 and 01005) components
  • Thick/Thin Film
  • Through Hole to SMT conversion
  • High-Mix Low-Medium-Large Volume
  • Conformal Coating & Epoxy Potting
  • Rapid Prototyping
  • Turnkey Manufacturing
  • Lead Free, RoHS Compliant  and Non-RoHS Process

GKG Singapore G-Titan Stencil Printer

Pick & Place  Fuji Japan : AIMEXIII C

X-Ray Inspection Machine  Glenbrook, USA – RTX-113

AOI – TRI, Taiwan : TR7700L SIII DT

Wave Solder M/c EMST STALLION 321FC JW

Inline Acqua PCB Cleaner Austin American Technology Microjet

Reflow Oven Model: RS-800II

STENCILS LASER CUT FRAME & FRAMELESS

Laser Cut stencils are created by using a laser to cut through SS sheet. The laser creates apertures, one at a time, with trapezoidal walls. Laser cut Stencils are provided directly from customer’s original Gerber data. This provides optimum solder paste volume control. A stencil can be made with excellent positional accuracy and reproducibility. 

The Gerber file, after the necessary modifications, is transferred to (and directly drives) the laser. Less physical intervention means fewer opportunities for error. Although as per the older laser technology, the users expressed initial concerns about the dross (vaporized molten metal) created by the laser beam, our top of the line next generation LPKF Laser machines developed during the last five years by LPKF Germany, with minimum burr (less than 3micron). The stencils have smooth aperture walls and can be used for 16 Mil pitch and below and for Micro BGA’s. The inner walls of the aperture can be electro polished to achieve a smooth finish.

Technical Specifications For Stencil:

  • Stencil thickness: .001 – .016 inches. 
  • Minimum cut width: .002 inches.
  • Standard sizes up to: 29″x29″ inches. We can supply different sizes with modifications if necessary.
  • Aperture tolerance within .00025 inches.
  • Make Framed SMT stencils for a variety of stencil printers.
  • Allow for Fiducial data.
  • Allow for Panelized data